Thin material for printed circuit boards for package substrates
It suppresses warping during reflow.
- The bending elastic modulus at high temperatures is very high, reducing warping during reflow. - The handling properties are good when processing thin substrates. - It is a high heat-resistant material while also exhibiting excellent moisture-resistant solder heat resistance. - The composition of the insulating layer is uniform, resulting in good laser processing capabilities. - It is an environmentally friendly substrate material that is halogen-free, phosphorus-free, and free of metal oxides.
- Company：利昌工業
- Price：Other
